SOLAR PRODUCTS OVERVIEW:
 The TSP-5000 Series of conductive pastes, developed by Taiyo Korea, are designed to have wide processing latitude in firing/sintering and are formulated so they may be co-fired to leave minimal residual stress and low warpage. These inks have similar Ohmic and contact resistance and are lead-free as are all products from Taiyo America.
FOC-800 USA has been used as either a dielectric coating or as a plating/etching resist for solar cell metallization. It is highly flexible and has low residual stress for low warpage, especially for thin wafer applications.
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| TSP-5000 FS01 - Front Side Metallization |
- Lead-Free, Silver Conductive Paste
- Screen Print Application - Excellent Line Edge Definition for High Efficiency
- Excellent Adhesion and Reliability
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| TSP-5000 RP-01 - Back Surface Metallization |
- Lead-Free, Aluminum Paste - High Conductivity
- Screen Print Application
- Excellent Adhesion and Reliability
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| TSP-5000 BE01 - Bus Bar Metallization |
- Lead-Free, Silver-Aluminum Paste
- Screen Print Application – Excellent Line-Space Resolution
- Similar CTE and Ohmic Contact Resistance
- Excellent Adhesion and Reliability
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| FOC-800 USA - Dielectric and Plating Resist |
- One Part, UV Curable
- Screen Print Application - Excellent Line-Space Resolution
- Excellent Flexibility
- Low Residual Stress - Low Warpage
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