| THP-100DX1 (HTG) |
- Highest Tg (173°C) and Lowest CTE (19/56 ppm) Available On the Market
- 100% Solids for Extremely Low Shrinkage
- No Chemical Attack through Desmear
- Halogen Free and RoHS Compliant
- High PCT and Thermal Resistance
- Designed Specifically for ITC Hole Filling Equipment; to Fill Small Vias Without Voids and Sagging
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| THP-100DX1 (GF) |
- Used to Fill High Copper Inner Layers to Achieve a Planar Outer Layer
- Screen Print Application with Flame Resistant Properties
- High Tg (160°C) and Low CTE (32/115 ppm)
- Very Low Shrinkage and Ease of Planarization
- No Chemical Attack through Desmear
- Halogen-Free and RoHS Compliant
- Excellent Adhesion Between Layers
- Compatible with Lead-Free Processing
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| THP-100DX1 |
- Available in Cans or De-Aerated Cartridges to Minimize Bubbles and Voids
- One-component Thermally Cured Hole Fill Material
- "SP" Version for Screen Print and "VF" Version for Machine Filling (Mass, ITC, etc.)
- Very Low Shrinkage
- Excellent Reliability and Compatibility with Copper Plating
- RoHS Compliant
- High PCT and Thermal Resistance
- Low Halogen
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| SCHP-7901 |
- Conductive Silver Paste Hole Plug
- Excellent Screening Characteristics to Plug Holes
- Single Component Thermal Cure Material
- Excellent Thermal Conductivity
- Good Reliability and Compatibility with Copper Plating
- RoHS Compliant and Lead-free Compatible
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| PIHP-200 |
- Photoimageable, Two Component Hole Plug
- Light Green Color
- Low Shrinkage
- For Plated or Non-Plated Holes
- Compatible with Solder Mask Top Coats
- RoHS Compliant and Lead-free Compatible
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| UVHP-100 |
- UV Cure, Single Component Hole Plug
- Light Green Color
- Low Shrinkage with 100% Solids
- For Plated or Non-Plated Holes
- Compatible with Solder Mask Top Coats
- RoHS Compliant and Lead-free Compatible
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